A high-level delegation led by James M. McKelvey Prof. Aaron BOPICK, Dean of McKelvey School of Engineering (McKelvey Engineering) of Washington University in St Louis (WashU), visited the Hong Kong Universtiy of Science and Technology (HKUST) on September 20, 2019 to sign a memorandum of understanding (MoU) to establish a framework within which cooperation may develop between the two leading universities in the world.
科大與聖路易斯華盛頓大學開展工程教育與研究合作 (只供英文版本)
2019-10-21
