A high-level delegation led by James M. McKelvey Prof. Aaron BOPICK, Dean of McKelvey School of Engineering (McKelvey Engineering) of Washington University in St Louis (WashU), visited the Hong Kong Universtiy of Science and Technology (HKUST) on September 20, 2019 to sign a memorandum of understanding (MoU) to establish a framework within which cooperation may develop between the two leading universities in the world.
科大与圣路易斯华盛顿大学开展工程教育与研究合作 (只供英文版本)
21-10-2019
