Awards & Recognitions
2019
Editor of Journal of Electronic Packaging, American Society of Mechanical
Honorary Member and Fellow of Physical Society of Hong Kong (PSHK)
Winner, The New York Times-APRU Asia-Pacific Student Case Competition 2019
Cherie Hiu Yu LEUNG, Veronica Qin Ting LI
Best Presenter’s Award, LEGO BRICKthrough Challenge
Tiffany SO
HKUST President’s Cup - Silver Award
Chun Sing CHOW
Fellow of the Institute of Electrical and Electronics Engineers (IEEE)
Dr. Xiaowu ZHANG
Progress Award Winner for 2019, Photographic Society of America
Prof. Ching Wan TANG
Member of the Hong Kong Young Academy of Sciences (YASHK)
2019 Excellent Young Scholar, National Natural Science Foundation of China
Scott Sloan Best Paper Award, The Inaugural 2019